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Faculty of Chemistry

Chemical Research Support

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Nanofabrication

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nanofabrication

Etching processes

In many cases, a crucial step in the nanofabrication of useful structures is the creation of patterns within layers of material. The removal of material, either in bulk from the entire substrate or selectively from specific regions of the substrate, is a common technique for…

Additive processes

As a necessary step in the nanofabrication of useful structures, layers of various materials are frequently deposited onto substrates. The substrate used in additive processes may or may not have previously formed material layers or patterned structures on its surface. Typically…

Scriber

Packaging and assembly

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Scriber

A wafer scriber is a tool used in the semiconductor industry for the purpose of cutting or scribing wafers.

The wafers are thin, circular pieces of semiconductor material, typically made from silicon, used as a substrate for fabricating integrated circuits and other electronic…

Mask Aligner

Patterning

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Mask Aligner

The MA6 mask aligner was designed to pattern parts of thin films using optical lithography. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate.

The Karl Suss MA6 is one of the most…

Microfluidics workstation

Microfluidics

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Microfluidics workstation

Microfluidics is both the science that studies the behavior of fluids through microchannels and the technology of manufacturing microminiaturized devices containing chambers and tunnels through which fluids flow or are confined.

Due to its use in a wide range of disciplines…

Chemical Workstations

Chemical works

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Chemical Workstations

Our laboratory has three chemical hoods, each dedicated to a different process: Solvent, lithography, and acids.

In the hoods are hotplates, spinners, ultrasonic baths, nitrogen, D.I. water guns, and a cold development station for PMMA.

Wirebonder

Packaging and assembly

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Wirebonder

Wire bonding is a method of interconnecting between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can connect an IC to other electronics or connect from one printed circuit…

RTP

Thermal

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RTP

Rapid Thermal Processing [RTP] is an advanced wafer processing technology used to expose wafers to heat over a short period of time. The term RTP applies to equipment that processes wafers at high throughput due to the ability to ramp temperature up and down in a matter of…

Olympus BX51 optical microscope

Inspection & Metrology

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Olympus BX51 optical microscope

Magnification: x5, x10, x20, x50, x100, x250

Top and bottom light sourcing

A high-quality darkfield effect at all magnifications.

Hand X&Y maneuvered stage with a rubber knob.

DIC observation system.

Yellow filter for the light source.

A trinocular tube with a high…

Zeta Optical Profiler

Inspection & Metrology

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Zeta Optical Profiler

The Zeta™-300 is a fully integrated optical non-contact profiling microscope that provides 3D metrology and imaging capability in a compact, robust package. The system is powered by ZDot™ technology, which simultaneously collects high-resolution 3D data and a True Color infinite…