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Ellipsometer

Inspection & Metrology

Booking

Ellipsometer

Ellipsometry is an optical technique for investigating the dielectric properties (complex refractive index or dielectric function) of thin films. Ellipsometry measures the change of polarization upon reflection or transmission and compares it to a model.

The ellipsometer…

Profilometer

Inspection & Metrology

Booking

Profilometer

Profilometry allows users to obtain a 2D trace of topographic features on a surface.

The Profilometer is most frequently used to determine the film thickness, the channel depth of microfluidic devices, and the roughness of treated surfaces.

The instrument has a vertical…

Plasma Asher

Etching processes

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Plasma Asher

This is a compact plasma treatment bench-top configuration system designed for a wide variety of plasma cleaning, surface activation and adhesion improvement applications.

A system chassis houses the plasma chamber, control electronics, 13.56 MHz RF generator, and the…

PT ICP – Plasma Therm ICP PTI-SHUTTLELOCK

Etching processes

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PT ICP – Plasma Therm ICP PTI-SHUTTLELOCK

Inductively Coupled Plasma (ICP) refers to a system configuration where plasma is generated using inductively coupling RF power in the source while independently controlling the ion energy bombarding the substrate via the applied bias power.

Features

Plasma generation is…

SPTS ICP - Omega LPX Rapier Etch System

Etching processes

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SPTS ICP - Omega LPX Rapier Etch System

The Inductively Coupled Plasma (ICP) etcher provides high chemical sensitivities with high etch rate. This SPTS ICP System uses fluorine-based gases for anisotropic deep silicon trench. The 13.56 MHz RF system produces a high-density, low- pressure, low-energy inductively coupled…

PECVD-Plasma-Therm Plasma Enhanced Chemical Vapor Deposition

Additive processes

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PECVD-Plasma-Therm Plasma Enhanced Chemical Vapor Deposition

Plasma-enhanced chemical vapor deposition (PECVD) is a process used to deposit SiO2, Si3N4, or SiOxNy dielectric films.

A plasma of reacting gases is created by R.F. (A.C.) frequency leading to chemical reactions in the chamber. Energy for chemical reactions is provided…

ALD- Fiji™ Plasma Atomic layer deposition system

Additive processes

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ALD- Fiji™ Plasma Atomic layer deposition system

Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process. ALD film growth is self-limited and based on surface reactions, which makes achieving atomic scale deposition control possible.

Most ALD reactions…

AJA Sputter ATC-1800

Additive processes

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AJA Sputter ATC-1800

The Sputtering system creates thin film layers of varied materials by a physical vapor deposition (PVD) method. Sputtering is a mechanism by which atoms are dislodged from the surface of a material because of collision with high-energy particles. Thus, Sputtering is a physical…

Angstrom Evaporator

Additive processes

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Angstrom Evaporator

The Angstrom is an E-Beam and thermal evaporator based on an Angstrom Engineering EvoVac PVD platform.

An evaporator is an instrument that produces thin film coatings of varied materials by heating the material till its starts to evaporate (transforms to its gas faze) by…

Odem Evaporator

Additive processes

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Odem Evaporator

The Odem- High throughput KW E.B.Gun system is designed for electron beam and thermal deposition produced by Odem Scientific Applications Ltd.

Electron Beam Evaporation is a form of physical vapor deposition in which an electron beam bombards the target material causing local…

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