Instrument Specification
Company: Logitech LTD
Model: PM6 Precision Lapping and Polishing System
Description: Chemical mechanical polishing system for lapping (thinning) and polishing diamond plates and wafers up to 4”.
Features:
- Process up to 100mm/4″ wafers.
- Up to 100rpm plate, speed facilitating faster-lapping rates.
- Driven jig roller arm with a linear sweep.
Main capabilities:
- Thinning diamond plates down to 50µm
- Polishing diamond to surface roughness down to Ra ~ 0.5Å (@ area of 2x2µm2)
Location
Schmidt Hall
Staff Contacts
-
Dr. Eran Mishuk
מהנדס חומרים
Training information
Consult with Eran Mishuk