Instrument Specification
Company: Sarine Technologies
Model: Quazer® 3
Description: The Quazer-3 uses high power (16W) 532nm Nd:YAG laser aimed to cut mm’s thick diamonds of different shapes.
Main capabilities:
- Slice diamonds plate (of several 100’s µm) into thinner plates. 100-150 µm slices can be achieved
- Remove the polycrystalline rim around single crystal diamonds grown by CVD
Location
Schmidt Hall
Staff Contacts
-
Dr. Eran Mishuk
מהנדס חומרים
Training information
Consult with Eran Mishuk